Our Quality Assurance Process

Our components are battle-tested. In addition, quality control checks are carried out throughout the process, from the initial inspection to the final testing of finished products.

1. Visual Inspection

Using a stereoscopic microscope, we conduct a 360° comprehensive observation of component appearances. Key inspection focus areas include:

Product packaging condition

Chip type, manufacturing date, and batch information

Printing quality and packaging integrity

Pin arrangement, coplanarity, and casing plating

Compliance with original manufacturer's external requirements

Anti-static and moisture protection standards verification

Identification of used or refurbished components

Visual inspection provides a quick assessment of whether components meet basic quality standards and helps identify obvious counterfeits or substandard products.

2. Solderability Testing

While not a counterfeit detection method (as oxidation occurs naturally), solderability testing is critical for ensuring functionality – especially in hot, humid climates such as:

Southeast Asia

Southern states in North America

Testing Standards & Methods:

Follows joint standard J-STD-002 for test methods and accept/reject criteria

"Dip-and-look" method for non-BGA surface mount devices

"Ceramic plate test" for BGA devices (recently added to our service suite)

Recommended for components that:

Are delivered in inappropriate packaging

Are over one year old (even in acceptable packaging)

Display pin contamination

3. X-Ray Inspection

X-ray technology enables 360° internal observation of components to verify:

Internal Structure Verification:

Consistency across multiple samples

Detection of mixed batches (Mixed-Up issues)

Compliance with specifications outlined in datasheets

Connection Status Analysis:

Integrity of chip-to-package pin connections

Identification of short circuits and open circuits

Verification of proper internal packaging connections

4. Functional/Programming Testing

We design comprehensive test protocols based on official datasheets, including:

Custom test boards

Specialized test platforms

Proprietary test programs

Capabilities:

Verify various functions of ICs to ensure they meet standards

Testable IC types:

Logic devices and analog devices

High-frequency ICs and power ICs

Various amplifiers

Power management ICs

Supported packages: DIP, SOP, SSOP, BGA, SOT, TO-220, QFN, QFP, etc.

Programming Equipment Capabilities:

Supports detection of 47,000 IC models from 208 manufacturers

Covers: EPROM, parallel/serial EEPROM, FPGA, configuration serial PROM, flash, BPROM, NOVRAM, SPLD, CPLD, EPLD, microcontrollers (MCU), and standard logic devices